Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

• Main Authors: Yap, Boon Kar, Dr., Noor Azrina, Talik, Zaliman, Sauli, Dr., Retnasamy, Vithyacharan
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Emerald Group Publishing Limited 2014
• Subjects: ABAQUS; Finite element analysis; Flip chip; Solder ball; Stress (materials); Thermal analysis
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33891

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