Description: Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

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Bibliographic Details
Main Authors:	Yap, Boon Kar, Dr., Noor Azrina, Talik, Zaliman, Sauli, Dr., Retnasamy, Vithyacharan
Other Authors:	kbyap@uniten.edu.my
Format:	Article
Language:	English
Published:	Emerald Group Publishing Limited 2014
Subjects:	ABAQUS Finite element analysis Flip chip Solder ball Stress (materials) Thermal analysis
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33891
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