Cover Image

Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

Link to publisher's homepage at http://www.emeraldinsight.com/

Saved in:
Bibliographic Details
Main Authors: Yap, Boon Kar, Dr., Noor Azrina, Talik, Zaliman, Sauli, Dr., Retnasamy, Vithyacharan
Other Authors: kbyap@uniten.edu.my
Format: Article
Language:English
Published: Emerald Group Publishing Limited 2014
Subjects:
ABAQUS
Finite element analysis
Flip chip
Solder ball
Stress (materials)
Thermal analysis
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33891
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.unimap-33891
record_format dspace
spelling my.unimap-338912014-04-21T09:17:26Z Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS Yap, Boon Kar, Dr. Noor Azrina, Talik Zaliman, Sauli, Dr. Retnasamy, Vithyacharan kbyap@uniten.edu.my zaliman@unimap.edu.my vc.sundres@gmail.com ABAQUS Finite element analysis Flip chip Solder ball Stress (materials) Thermal analysis Link to publisher's homepage at http://www.emeraldinsight.com/ Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection technology for flip chip package is getting finer and smaller, it is extremely difficult to obtain the accurate values of thermal stresses by direct experimental measurements. Different types of solder bumps used for interconnection would also influence the thermal distribution within the package. Because the solder balls are too small for direct measurement of their stresses, finite element method (FEM) was used for obtaining the stresses instead. Design/methodology/approach - This paper will discuss the results of the thermal stress distribution using numerical method via ABAQUS software. The variation of the thermal stress distribution with the temperature gradient model was evaluated to study the effects of the different material thermal conductivity of solder bumps used. A detailed 2D finite element model was constructed to perform 2D plain strain elastoplastic analysis to predict areas of high stress. Findings - It is found that thermal distribution of solder bumps starts to propagate from the top region to the bottom region of the solder balls. Other than that, thermal stress effect increases in parallel with the increasing of the temperature. The simulation results shows that leaded solder balls, SnPb have higher maximum thermal stress level compared to lead-free SAC solder balls. Originality/value - The paper describes combination of stress with thermal loading correlation on a flip chip model. The work also shows how the different thermal conductivity on solder balls influences the thermal induced stress on the flip chip package. 2014-04-21T09:17:26Z 2014-04-21T09:17:26Z 2013 Article Microelectronics International, vol. 30(1), 2013, pages 14-18 1356-5362 http://www.emeraldinsight.com/journals.htm?articleid=17076670 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33891 en Emerald Group Publishing Limited
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic ABAQUS
Finite element analysis
Flip chip
Solder ball
Stress (materials)
Thermal analysis
spellingShingle ABAQUS
Finite element analysis
Flip chip
Solder ball
Stress (materials)
Thermal analysis
Yap, Boon Kar, Dr.
Noor Azrina, Talik
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS
description Link to publisher's homepage at http://www.emeraldinsight.com/
author2 kbyap@uniten.edu.my
author_facet kbyap@uniten.edu.my
Yap, Boon Kar, Dr.
Noor Azrina, Talik
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
format Article
author Yap, Boon Kar, Dr.
Noor Azrina, Talik
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
author_sort Yap, Boon Kar, Dr.
title Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS
title_short Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS
title_full Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS
title_fullStr Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS
title_full_unstemmed Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS
title_sort finite element analysis of thermal distributions of solder ball in flip chip ball grid array using abaqus
publisher Emerald Group Publishing Limited
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33891
_version_ 1643797327934128128
score 13.222552

Similar Items