Flow analysis for flip chip underfilling process using characteristic based split method

• Main Authors: Kulkarni, Venkatesh M., Seetharamu, Kankanhally N., Aswatha Narayana, P. A., Ishak, Abdul Azid, Dr., Ghulam, Abdul Quadir, Prof. Dr.
• Other Authors: [e-mail]
• Format: Working Paper
• Language: English
• Published: IEEE Conference Publications 2014
• Subjects: Characteristic based split (CBS); Fluid flow equation; Onvection-diffusion equation; Volume of fluid (VoF); Flip chip devices
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33885

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