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Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives

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Main Authors: Ho, Li Ngee, Dr., Hiroshi, Nishikawa
Other Authors: holingee@yahoo.com
Format: Article
Language:English
Published: Springer Science+Business Media New York 2014
Subjects:
Adhesive materials
Conductive fillers
Electrical and mechanical properties
Electrical conductivity
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33186
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spelling my.unimap-331862017-11-29T06:59:19Z Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives Ho, Li Ngee, Dr. Hiroshi, Nishikawa holingee@yahoo.com lnho@unimap.edu.my Adhesive materials Conductive fillers Electrical and mechanical properties Electrical conductivity Link to publisher's homepage at http://link.springer.com/ Effects of post curing and silane coupling agents with different functional groups such as epoxy, isocyanate and ureide on the electrical and mechanical properties of copper (Cu) filled electrically conductive adhesives (ECAs) were studied. Micron-sized Cu particles were used as conductive fillers and polyurethane resin was applied as the adhesive material. Significant differences could be observed on the as cured electrical resistivity and shear strength of the Cu filled ECAs joints prepared with different silane coupling agents. Silane coupling agents functionalized with epoxy groups yielded the lowest electrical resistivity and highest shear strength among the ECAs in this study. Besides, effect of post-curing at 170 C for 1 h on the ECAs was also investigated. Results showed that ECAs after post-curing exhibited enhanced electrical conductivity and shear strength compared to the as cured ECAs. 2014-03-28T03:29:52Z 2014-03-28T03:29:52Z 2013-06 Article Journal of Materials Science: Materials in Electronics, vol. 24(6), 2013, pages 2077-2081 0957-4522 http://link.springer.com/article/10.1007%2Fs10854-012-1059-0 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33186 en Springer Science+Business Media New York
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Adhesive materials
Conductive fillers
Electrical and mechanical properties
Electrical conductivity
spellingShingle Adhesive materials
Conductive fillers
Electrical and mechanical properties
Electrical conductivity
Ho, Li Ngee, Dr.
Hiroshi, Nishikawa
Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
description Link to publisher's homepage at http://link.springer.com/
author2 holingee@yahoo.com
author_facet holingee@yahoo.com
Ho, Li Ngee, Dr.
Hiroshi, Nishikawa
format Article
author Ho, Li Ngee, Dr.
Hiroshi, Nishikawa
author_sort Ho, Li Ngee, Dr.
title Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
title_short Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
title_full Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
title_fullStr Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
title_full_unstemmed Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
title_sort influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
publisher Springer Science+Business Media New York
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33186
_version_ 1643802745784762368
score 13.214268

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