Description: Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives

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Bibliographic Details
Main Authors:	Ho, Li Ngee, Dr., Hiroshi, Nishikawa
Other Authors:	holingee@yahoo.com
Format:	Article
Language:	English
Published:	Springer Science+Business Media New York 2014
Subjects:	Adhesive materials Conductive fillers Electrical and mechanical properties Electrical conductivity
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33186
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Summary:	Link to publisher's homepage at http://link.springer.com/