Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging

• Main Authors: Chong, Leong Gan, E., K. Ng, Bak, Lee Chan, Classe, Francis, Kwuanjai, T., Uda, Hashim, Prof. Dr.
• 其他作者: [e-mail]
• 格式: Article
• 语言: English
• 出版: Hindawi Publishing Corporation 2014
• 主题: Cu wires; Nanoscale device; Diffusion kinetics; Wire bonds
• 在线阅读: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33100

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