Description: Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging

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Bibliographic Details
Main Authors:	Chong, Leong Gan, E., K. Ng, Bak, Lee Chan, Classe, Francis, Kwuanjai, T., Uda, Hashim, Prof. Dr.
Other Authors:	clgan_pgg@yahoo.com
Format:	Article
Language:	English
Published:	Hindawi Publishing Corporation 2014
Subjects:	Cu wires Nanoscale device Diffusion kinetics Wire bonds
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33100
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Summary:	Link to publisher's homepage at http://www.hindawi.com/