Chong, L. G., & clgan_pgg@yahoo.com. (2014). Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging. Hindawi Publishing Corporation.
Chicago Style CitationChong, Leong Gan, and clgan_pgg@yahoo.com. Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging. Hindawi Publishing Corporation, 2014.
MLA CitationChong, Leong Gan, and clgan_pgg@yahoo.com. Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging. Hindawi Publishing Corporation, 2014.
Warning: These citations may not always be 100% accurate.