Wire bond shear test simulation

The 2nd International Malaysia-Ireland Joint Symposium on Engineering, Science and Business 2012 (IMiEJS2012) jointly organized by Universiti Malaysia Perlis and Athlone Institute of Technology in collaboration with The Ministry of Higher Education (MOHE) Malaysia, Education Malaysia and Malaysia Po...

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Main Authors: Vairavan, Rajendaran, Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Taniselass, Steven, Wan Mokhzani, Wan Norhaimi
Other Authors: rajendaran@gmail.com
Format: Working Paper
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2013
Subjects:
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/30761
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spelling my.unimap-307612013-12-23T04:27:20Z Wire bond shear test simulation Vairavan, Rajendaran Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Taniselass, Steven Wan Mokhzani, Wan Norhaimi rajendaran@gmail.com zaliman@unimap.edu.my rcharan@unimap.edu.my steven@unimap.edu.my wanmokhdzani@unimap.edu.my Wire bond Shear Test ANSYS The 2nd International Malaysia-Ireland Joint Symposium on Engineering, Science and Business 2012 (IMiEJS2012) jointly organized by Universiti Malaysia Perlis and Athlone Institute of Technology in collaboration with The Ministry of Higher Education (MOHE) Malaysia, Education Malaysia and Malaysia Postgraduates Student Association Ireland (MyPSI), 18th - 19th June 2012 at Putra World Trade Center (PWTC), Kuala Lumpur, Malaysia. Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response of the bonded wire during wire bond shear test.Comparisons between three types of wire material:gold(Au), aluminum(Al) and copper(Cu) were done to scrutinize the effects of wire material on the stress response of bonded wire during wire bond shear test. The simulation results showed that copper wire bond induces higher stress compared to aluminum and gold wire bond during wire bond shear test. 2013-12-23T04:27:20Z 2013-12-23T04:27:20Z 2012-06-18 Working Paper p. 788 - 792 978-967-5760-11-2 http://hdl.handle.net/123456789/30761 en Proceedings of the The 2nd International Malaysia-Ireland Joint Symposium on Engineering, Science and Business 2012 (IMiEJS2012); Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Wire bond
Shear Test
ANSYS
spellingShingle Wire bond
Shear Test
ANSYS
Vairavan, Rajendaran
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Taniselass, Steven
Wan Mokhzani, Wan Norhaimi
Wire bond shear test simulation
description The 2nd International Malaysia-Ireland Joint Symposium on Engineering, Science and Business 2012 (IMiEJS2012) jointly organized by Universiti Malaysia Perlis and Athlone Institute of Technology in collaboration with The Ministry of Higher Education (MOHE) Malaysia, Education Malaysia and Malaysia Postgraduates Student Association Ireland (MyPSI), 18th - 19th June 2012 at Putra World Trade Center (PWTC), Kuala Lumpur, Malaysia.
author2 rajendaran@gmail.com
author_facet rajendaran@gmail.com
Vairavan, Rajendaran
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Taniselass, Steven
Wan Mokhzani, Wan Norhaimi
format Working Paper
author Vairavan, Rajendaran
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Taniselass, Steven
Wan Mokhzani, Wan Norhaimi
author_sort Vairavan, Rajendaran
title Wire bond shear test simulation
title_short Wire bond shear test simulation
title_full Wire bond shear test simulation
title_fullStr Wire bond shear test simulation
title_full_unstemmed Wire bond shear test simulation
title_sort wire bond shear test simulation
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2013
url http://dspace.unimap.edu.my/xmlui/handle/123456789/30761
_version_ 1643795627536023552
score 13.222552