Wire bond shear test simulation
The 2nd International Malaysia-Ireland Joint Symposium on Engineering, Science and Business 2012 (IMiEJS2012) jointly organized by Universiti Malaysia Perlis and Athlone Institute of Technology in collaboration with The Ministry of Higher Education (MOHE) Malaysia, Education Malaysia and Malaysia Po...
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2013
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my.unimap-307612013-12-23T04:27:20Z Wire bond shear test simulation Vairavan, Rajendaran Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Taniselass, Steven Wan Mokhzani, Wan Norhaimi rajendaran@gmail.com zaliman@unimap.edu.my rcharan@unimap.edu.my steven@unimap.edu.my wanmokhdzani@unimap.edu.my Wire bond Shear Test ANSYS The 2nd International Malaysia-Ireland Joint Symposium on Engineering, Science and Business 2012 (IMiEJS2012) jointly organized by Universiti Malaysia Perlis and Athlone Institute of Technology in collaboration with The Ministry of Higher Education (MOHE) Malaysia, Education Malaysia and Malaysia Postgraduates Student Association Ireland (MyPSI), 18th - 19th June 2012 at Putra World Trade Center (PWTC), Kuala Lumpur, Malaysia. Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response of the bonded wire during wire bond shear test.Comparisons between three types of wire material:gold(Au), aluminum(Al) and copper(Cu) were done to scrutinize the effects of wire material on the stress response of bonded wire during wire bond shear test. The simulation results showed that copper wire bond induces higher stress compared to aluminum and gold wire bond during wire bond shear test. 2013-12-23T04:27:20Z 2013-12-23T04:27:20Z 2012-06-18 Working Paper p. 788 - 792 978-967-5760-11-2 http://hdl.handle.net/123456789/30761 en Proceedings of the The 2nd International Malaysia-Ireland Joint Symposium on Engineering, Science and Business 2012 (IMiEJS2012); Universiti Malaysia Perlis (UniMAP) |
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Wire bond Shear Test ANSYS |
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Wire bond Shear Test ANSYS Vairavan, Rajendaran Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Taniselass, Steven Wan Mokhzani, Wan Norhaimi Wire bond shear test simulation |
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The 2nd International Malaysia-Ireland Joint Symposium on Engineering, Science and Business 2012 (IMiEJS2012) jointly organized by Universiti Malaysia Perlis and Athlone Institute of Technology in collaboration with The Ministry of Higher Education (MOHE) Malaysia, Education Malaysia and Malaysia Postgraduates Student Association Ireland (MyPSI), 18th - 19th June 2012 at Putra World Trade Center (PWTC), Kuala Lumpur, Malaysia. |
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rajendaran@gmail.com |
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rajendaran@gmail.com Vairavan, Rajendaran Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Taniselass, Steven Wan Mokhzani, Wan Norhaimi |
format |
Working Paper |
author |
Vairavan, Rajendaran Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Taniselass, Steven Wan Mokhzani, Wan Norhaimi |
author_sort |
Vairavan, Rajendaran |
title |
Wire bond shear test simulation |
title_short |
Wire bond shear test simulation |
title_full |
Wire bond shear test simulation |
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Wire bond shear test simulation |
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Wire bond shear test simulation |
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wire bond shear test simulation |
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Universiti Malaysia Perlis (UniMAP) |
publishDate |
2013 |
url |
http://dspace.unimap.edu.my/xmlui/handle/123456789/30761 |
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1643795627536023552 |
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13.222552 |