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Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application

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Bibliographic Details
Main Authors: Mazlan, Mohamed, Rahim, Atan, Prof. Madya Dr., Mohd Mustafa Al Bakri, Abdullah, Muhammad Iqbal, Ahmad, Mohd Huzaifah, Yusoff, Fathinul Najib, Ahmad Saad
Other Authors: mazlan547@ppinang.uitm.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2013
Subjects:
Average junction temperature
Nano-silver
Numerical simulation
PLCC package
Thermal management
Thermal pad
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/23480
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