Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application
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Trans Tech Publications
2013
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my.unimap-234802013-02-13T06:46:47Z Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application Mazlan, Mohamed Rahim, Atan, Prof. Madya Dr. Mohd Mustafa Al Bakri, Abdullah Muhammad Iqbal, Ahmad Mohd Huzaifah, Yusoff Fathinul Najib, Ahmad Saad mazlan547@ppinang.uitm.edu.my rahimatan@salam.uitm.edu.my mustafa_albakri@unimap.edu.my Average junction temperature Nano-silver Numerical simulation PLCC package Thermal management Thermal pad Link to publisher's homepage at http://www.ttp.net/ Thermal pad is new technology in this world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. In electronic industry, the electronic components that exceed 70°C will malfunction and damage due to the overheated. The design is used nano-silver as main material in thermo pad because it has high value of thermal conductivity and enables to dissipate heat very efficiently. The simulation of thermal pad in semiconductor is using FLUENTTM software. The results from simulation is been compared to the results from experiment. The differences between those results are less than 10%. The advantages of thermal pad are enables to reduce junction temperature of PLCC 20-30%. It also had constant thickness in order to get constant and accurate results. 2013-02-13T06:46:47Z 2013-02-13T06:46:47Z 2013 Article Advanced Materials Research, vol. 626, 2013, pages 980-988 1022-6680 http://www.scientific.net/AMR.626.980 http://hdl.handle.net/123456789/23480 en Trans Tech Publications |
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English |
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Average junction temperature Nano-silver Numerical simulation PLCC package Thermal management Thermal pad |
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Average junction temperature Nano-silver Numerical simulation PLCC package Thermal management Thermal pad Mazlan, Mohamed Rahim, Atan, Prof. Madya Dr. Mohd Mustafa Al Bakri, Abdullah Muhammad Iqbal, Ahmad Mohd Huzaifah, Yusoff Fathinul Najib, Ahmad Saad Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application |
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Link to publisher's homepage at http://www.ttp.net/ |
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mazlan547@ppinang.uitm.edu.my |
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mazlan547@ppinang.uitm.edu.my Mazlan, Mohamed Rahim, Atan, Prof. Madya Dr. Mohd Mustafa Al Bakri, Abdullah Muhammad Iqbal, Ahmad Mohd Huzaifah, Yusoff Fathinul Najib, Ahmad Saad |
| format |
Article |
| author |
Mazlan, Mohamed Rahim, Atan, Prof. Madya Dr. Mohd Mustafa Al Bakri, Abdullah Muhammad Iqbal, Ahmad Mohd Huzaifah, Yusoff Fathinul Najib, Ahmad Saad |
| author_sort |
Mazlan, Mohamed |
| title |
Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application |
| title_short |
Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application |
| title_full |
Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application |
| title_fullStr |
Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application |
| title_full_unstemmed |
Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application |
| title_sort |
three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application |
| publisher |
Trans Tech Publications |
| publishDate |
2013 |
| url |
http://dspace.unimap.edu.my/xmlui/handle/123456789/23480 |
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1643794005105836032 |
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13.214268 |