Electromigration damage in lead-free solder joints prepared using metallic nanoparticle doped flux / Muhammad Nasir

• Main Author: Muhammad , Nasir
• Format: Thesis
• Published: 2017
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://studentsrepo.um.edu.my/8112/1/All.pdf; http://studentsrepo.um.edu.my/8112/6/nasir.pdf; http://studentsrepo.um.edu.my/8112/

Miniaturization of microelectronic devices and the associated increase in current density during operation raise concerns over electromigration (EM) damage in solder joints. This thesis focuses on the effects of Ni and Co nanoparticle (NP) doped flux on the microstructure, mechanical and electrical...