Modeling of the effects of athermal flow strength and activation energy for dislocation glide an the nanoindentation creep of nickel thin film at room temperature

Nanoindentation creep behaviour of nickel at room temperature has been modeled based on the obstacle-controlled dislocation glide mechanism. Using the model, the effects of two important materials parameters viz. the activation free energy required by dislocation to overcome an obstacle without any...

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Main Author: Haseeb, A.S. Md. Abdul
Format: Article
Published: Elsevier 2006
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Online Access:http://eprints.um.edu.my/5767/
https://doi.org/10.1016/j.commatsci.2005.07.006
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spelling my.um.eprints.57672018-10-16T05:03:37Z http://eprints.um.edu.my/5767/ Modeling of the effects of athermal flow strength and activation energy for dislocation glide an the nanoindentation creep of nickel thin film at room temperature Haseeb, A.S. Md. Abdul TA Engineering (General). Civil engineering (General) Nanoindentation creep behaviour of nickel at room temperature has been modeled based on the obstacle-controlled dislocation glide mechanism. Using the model, the effects of two important materials parameters viz. the activation free energy required by dislocation to overcome an obstacle without any aid from external stress, Delta F and the athermal flow strength, tau(0), which is the flow strength of solids at 0 K are systematically studied. It has been found that Delta F plays a dominant role in room temperature creep properties of nickel. The role of Delta F is particularly dominant in determining the time dependent deformation. On the other hand, role of tau(0) is more crucial in the case of instantaneous deformation. (c) 2005 Elsevier B.V. All rights reserved. Elsevier 2006 Article PeerReviewed Haseeb, A.S. Md. Abdul (2006) Modeling of the effects of athermal flow strength and activation energy for dislocation glide an the nanoindentation creep of nickel thin film at room temperature. Computational Materials Science, 37 (3). pp. 278-283. ISSN 0927-0256 https://doi.org/10.1016/j.commatsci.2005.07.006 doi:10.1016/j.commatsci.2005.07.006
institution Universiti Malaya
building UM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaya
content_source UM Research Repository
url_provider http://eprints.um.edu.my/
topic TA Engineering (General). Civil engineering (General)
spellingShingle TA Engineering (General). Civil engineering (General)
Haseeb, A.S. Md. Abdul
Modeling of the effects of athermal flow strength and activation energy for dislocation glide an the nanoindentation creep of nickel thin film at room temperature
description Nanoindentation creep behaviour of nickel at room temperature has been modeled based on the obstacle-controlled dislocation glide mechanism. Using the model, the effects of two important materials parameters viz. the activation free energy required by dislocation to overcome an obstacle without any aid from external stress, Delta F and the athermal flow strength, tau(0), which is the flow strength of solids at 0 K are systematically studied. It has been found that Delta F plays a dominant role in room temperature creep properties of nickel. The role of Delta F is particularly dominant in determining the time dependent deformation. On the other hand, role of tau(0) is more crucial in the case of instantaneous deformation. (c) 2005 Elsevier B.V. All rights reserved.
format Article
author Haseeb, A.S. Md. Abdul
author_facet Haseeb, A.S. Md. Abdul
author_sort Haseeb, A.S. Md. Abdul
title Modeling of the effects of athermal flow strength and activation energy for dislocation glide an the nanoindentation creep of nickel thin film at room temperature
title_short Modeling of the effects of athermal flow strength and activation energy for dislocation glide an the nanoindentation creep of nickel thin film at room temperature
title_full Modeling of the effects of athermal flow strength and activation energy for dislocation glide an the nanoindentation creep of nickel thin film at room temperature
title_fullStr Modeling of the effects of athermal flow strength and activation energy for dislocation glide an the nanoindentation creep of nickel thin film at room temperature
title_full_unstemmed Modeling of the effects of athermal flow strength and activation energy for dislocation glide an the nanoindentation creep of nickel thin film at room temperature
title_sort modeling of the effects of athermal flow strength and activation energy for dislocation glide an the nanoindentation creep of nickel thin film at room temperature
publisher Elsevier
publishDate 2006
url http://eprints.um.edu.my/5767/
https://doi.org/10.1016/j.commatsci.2005.07.006
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score 13.214268