Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix

• Main Authors: Bashir, M. Nasir, Haseeb, A. S. Md Abdul, Wakeel, Saif, Khan, Muhammad Ali, Quazi, M. M., Khan, Niaz Bahadur, Ahmed, Arslan, Soudagar, Manzoore Elahi M.
• Format: Article
• Published: Springer 2022
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.um.edu.my/41339/

Microstructure of the eutectic region and beta-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In the present study, Ni and Co nanoparticle (NP)-doped flux were added into the SAC305 solder matrix to observe their effect on the microstructure of the eutectic region and beta-Sn grain during the reflow process. Results reveal that after the addition of Ni and Co NP-doped flux, the size of beta-Sn grain and the size of IMC particles present in the eutectic region significantly reduced. The area of the eutectic region also increased. Reduction in size of beta-Sn grain and IMC particles improves the mechanical and structural properties of the solder joint.