In-situ study of electrochemical migration of tin in the presence of bromide ion

The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the ECM process. This work systematically investigates th...

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Main Authors: Lee, Ee Lynn, Haseeb, A. S. M. A., Basirun, Wan Jeffrey, Wong, Yew Hoong, Mohd Sabri, Mohd Faizul, Low, Boon Yew
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Published: Nature Research 2021
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Online Access:http://eprints.um.edu.my/28293/
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spelling my.um.eprints.282932022-07-29T14:38:03Z http://eprints.um.edu.my/28293/ In-situ study of electrochemical migration of tin in the presence of bromide ion Lee, Ee Lynn Haseeb, A. S. M. A. Basirun, Wan Jeffrey Wong, Yew Hoong Mohd Sabri, Mohd Faizul Low, Boon Yew QD Chemistry The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the ECM process. This work systematically investigates the ECM of tin (Sn) in the presence of bromide ions (Br-) in the range of 10(-6) M to 1.0 M. Water drop test (WDT) was conducted in the two-probe semiconductor characterization system under an optical microscope as an in-situ observation. Polarization test was carried out to study the correlation between the corrosion properties of Sn and its ECM behaviour. The products of ECM were characterized by scanning electron microscope coupled with an energy dispersive X-rays spectrometer (SEM/EDX) and X-ray photoelectron spectrometer (XPS). The results confirm that the rate of anodic dissolution of Sn monotonously increases with the Br- concentration. However, the probability of ECM failure follows a normal distribution initially, but later increases with the Br- concentration. The main products of the ECM reactions are identified as Sn dendrites and tin hydroxide precipitates. The mechanisms of the ECM process of Sn in the presence of Br- are also suggested. Nature Research 2021-08-03 Article PeerReviewed Lee, Ee Lynn and Haseeb, A. S. M. A. and Basirun, Wan Jeffrey and Wong, Yew Hoong and Mohd Sabri, Mohd Faizul and Low, Boon Yew (2021) In-situ study of electrochemical migration of tin in the presence of bromide ion. Scientific Reports, 11 (1). ISSN 2045-2322, DOI https://doi.org/10.1038/s41598-021-95276-0 <https://doi.org/10.1038/s41598-021-95276-0>. 10.1038/s41598-021-95276-0
institution Universiti Malaya
building UM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaya
content_source UM Research Repository
url_provider http://eprints.um.edu.my/
topic QD Chemistry
spellingShingle QD Chemistry
Lee, Ee Lynn
Haseeb, A. S. M. A.
Basirun, Wan Jeffrey
Wong, Yew Hoong
Mohd Sabri, Mohd Faizul
Low, Boon Yew
In-situ study of electrochemical migration of tin in the presence of bromide ion
description The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the ECM process. This work systematically investigates the ECM of tin (Sn) in the presence of bromide ions (Br-) in the range of 10(-6) M to 1.0 M. Water drop test (WDT) was conducted in the two-probe semiconductor characterization system under an optical microscope as an in-situ observation. Polarization test was carried out to study the correlation between the corrosion properties of Sn and its ECM behaviour. The products of ECM were characterized by scanning electron microscope coupled with an energy dispersive X-rays spectrometer (SEM/EDX) and X-ray photoelectron spectrometer (XPS). The results confirm that the rate of anodic dissolution of Sn monotonously increases with the Br- concentration. However, the probability of ECM failure follows a normal distribution initially, but later increases with the Br- concentration. The main products of the ECM reactions are identified as Sn dendrites and tin hydroxide precipitates. The mechanisms of the ECM process of Sn in the presence of Br- are also suggested.
format Article
author Lee, Ee Lynn
Haseeb, A. S. M. A.
Basirun, Wan Jeffrey
Wong, Yew Hoong
Mohd Sabri, Mohd Faizul
Low, Boon Yew
author_facet Lee, Ee Lynn
Haseeb, A. S. M. A.
Basirun, Wan Jeffrey
Wong, Yew Hoong
Mohd Sabri, Mohd Faizul
Low, Boon Yew
author_sort Lee, Ee Lynn
title In-situ study of electrochemical migration of tin in the presence of bromide ion
title_short In-situ study of electrochemical migration of tin in the presence of bromide ion
title_full In-situ study of electrochemical migration of tin in the presence of bromide ion
title_fullStr In-situ study of electrochemical migration of tin in the presence of bromide ion
title_full_unstemmed In-situ study of electrochemical migration of tin in the presence of bromide ion
title_sort in-situ study of electrochemical migration of tin in the presence of bromide ion
publisher Nature Research
publishDate 2021
url http://eprints.um.edu.my/28293/
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score 13.211869