A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package

• المؤلفون الرئيسيون: Zhou, Ding, Haseeb, A.S. Md. Abdul, Andriyana, Andri, Wong, Yew Hoong, Sabri, Mohd Faizul Mohd, Low, B.Y., Pang, X.S., Eu, Poh Leng, Tan, L.C.
• التنسيق: مقال
• اللغة: English
• منشور في: Institute of Electrical and Electronics Engineers 2021
• الموضوعات: TJ Mechanical engineering and machinery
• الوصول للمادة أونلاين: http://eprints.um.edu.my/25877/1/25877.pdf; http://eprints.um.edu.my/25877/; https://doi.org/10.1109/TCPMT.2020.3046750

Due to the variation of temperature during service, the leads in quad flat packages (QFP) and plastic leaded chip carrier (PLCC) undergo high thermal stress, which can lead to large deformation and failure. Thus, the prediction of thermal stress and strain distributions is a prerequisite for reliabi...