Zhou, D. (2021). A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package. Institute of Electrical and Electronics Engineers.
استشهاد بنمط شيكاغوZhou, Ding. A Parametric Study of Thermal Stress and Analysis of Creep Strain Under Thermal Cyclic Loading in a Hybrid Quad Flat Package. Institute of Electrical and Electronics Engineers, 2021.
MLA استشهادZhou, Ding. A Parametric Study of Thermal Stress and Analysis of Creep Strain Under Thermal Cyclic Loading in a Hybrid Quad Flat Package. Institute of Electrical and Electronics Engineers, 2021.
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