Application of laser heating and its effects on bonding strengths for varied copper wire purity levels

• 主要な著者: Singh, Gurbinder, Haseeb, A.S. Md. Abdul
• フォーマット: 論文
• 出版事項: Laser Institute of America 2018
• 主題: TJ Mechanical engineering and machinery
• オンライン･アクセス: http://eprints.um.edu.my/20654/; https://doi.org/10.2351/1.5008639

Gold as the medium of interconnection is rapidly being replaced by copper as a means of creating connectivity in integrated circuit packaging. However, the use of copper wire is known to pose many threats in integrated circuit packaging, especially for devices with very thin die structures. The proc...