APA Citation

Goh, Y. (2015). Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints. Kluwer (now part of Springer).

Chicago Style Citation

Goh, Y. Deformation and Fracture Behaviour of Electroplated Sn–Bi/Cu Solder Joints. Kluwer (now part of Springer), 2015.

MLA Citation

Goh, Y. Deformation and Fracture Behaviour of Electroplated Sn–Bi/Cu Solder Joints. Kluwer (now part of Springer), 2015.

Warning: These citations may not always be 100% accurate.