Characterisation of insulated Cu wire ball bonding

• المؤلفون الرئيسيون: Leong, H.Y., Yap, B.K., Khan, N., Ibrahim, M.R., Tan, L.C., Faiz, M.
• التنسيق: مقال
• منشور في: Maney Publishing 2014
• الموضوعات: Q Science (General)
• الوصول للمادة أونلاين: http://eprints.um.edu.my/15473/

Insulated Cu wire technology offers potential solutions for fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous works focused on insulated wire stitch bonding. This paper presents a comparison study between insulated Cu and...