Wire sweep improvement study of multi-tier palladium-copper wire bonding on low-quad flat package using low-alpha green mould compound

• Main Authors: Ali, S.S.S., Teh, S.S.H., Ang, B.C.
• 格式: Article
• 出版: Springer Verlag (Germany) 2014
• 主題: Q Science (General)
• 在線閱讀: http://eprints.um.edu.my/15467/

In this paper, a short-shot mould study is performed on device M in order to understand the mould-filling patterns during mould encapsulation. The wire sweep performance is evaluated for two die thicknesses, wire loop heights and various moulding compounds. Moreover, the actual length of worst swept...