Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim

• Main Author: Abu Kassim, Mohd Nor Fadli
• Format: Thesis
• Language: English
• Published: 2009
• Subjects: TK Electrical engineering. Electronics. Nuclear engineering
• Online Access: https://ir.uitm.edu.my/id/eprint/98476/1/98476.pdf; https://ir.uitm.edu.my/id/eprint/98476/

This paper describes a deflection of encapsulation material on Lab-on-Chip (LOC) Biomedical device. The packaging technologies as described in this paper represent important steps in developing a user-friendly, practically usable encapsulation LOC device from a bare biochip. This development aims at...