Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim
This paper describes a deflection of encapsulation material on Lab-on-Chip (LOC) Biomedical device. The packaging technologies as described in this paper represent important steps in developing a user-friendly, practically usable encapsulation LOC device from a bare biochip. This development aims at...
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Format: | Thesis |
Language: | English |
Published: |
2009
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Online Access: | https://ir.uitm.edu.my/id/eprint/98476/1/98476.pdf https://ir.uitm.edu.my/id/eprint/98476/ |
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