Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim

• Main Author: Abu Kassim, Mohd Nor Fadli
• Format: Thesis
• Language: English
• Published: 2009
• Subjects: TK Electrical engineering. Electronics. Nuclear engineering
• Online Access: https://ir.uitm.edu.my/id/eprint/98476/1/98476.pdf; https://ir.uitm.edu.my/id/eprint/98476/

This paper describes a deflection of encapsulation material on Lab-on-Chip (LOC) Biomedical device. The packaging technologies as described in this paper represent important steps in developing a user-friendly, practically usable encapsulation LOC device from a bare biochip. This development aims at a prototype device that can be applied for the evaluation of the biochip's analytical properties and the implementation of suitable assays in the field of medical diagnostic testing. The study involve in determine the best material for outer encapsulation which is required to protect the sensitive element on LOC during high-pressure transfer molded packaging process. The encapsulation material has to have maximum top surface deflection of 100 um under 100 atm vertical loading. The modeling was simulated using CoventorWare ver.2008 software. The material selected for these encapsulation LOC were Polyphenylene Sulfide (PPS) high modulus carbon fiber 55% and Liquid Crystal Polymer (LCP) carbon fiber. From the result it conclude that the PPS high modulus carbon fiber 55% is suitable for encapsulates LOC compared to LCP carbon fiber due to its strength, capable to endure deflection less than 100 um under uniform pressure applied on the top of encapsulation.