Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim

This paper describes a deflection of encapsulation material on Lab-on-Chip (LOC) Biomedical device. The packaging technologies as described in this paper represent important steps in developing a user-friendly, practically usable encapsulation LOC device from a bare biochip. This development aims at...

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Main Author: Abu Kassim, Mohd Nor Fadli
Format: Thesis
Language:English
Published: 2009
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Online Access:https://ir.uitm.edu.my/id/eprint/98476/1/98476.pdf
https://ir.uitm.edu.my/id/eprint/98476/
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spelling my.uitm.ir.984762024-08-22T09:18:38Z https://ir.uitm.edu.my/id/eprint/98476/ Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim Abu Kassim, Mohd Nor Fadli TK Electrical engineering. Electronics. Nuclear engineering This paper describes a deflection of encapsulation material on Lab-on-Chip (LOC) Biomedical device. The packaging technologies as described in this paper represent important steps in developing a user-friendly, practically usable encapsulation LOC device from a bare biochip. This development aims at a prototype device that can be applied for the evaluation of the biochip's analytical properties and the implementation of suitable assays in the field of medical diagnostic testing. The study involve in determine the best material for outer encapsulation which is required to protect the sensitive element on LOC during high-pressure transfer molded packaging process. The encapsulation material has to have maximum top surface deflection of 100 um under 100 atm vertical loading. The modeling was simulated using CoventorWare ver.2008 software. The material selected for these encapsulation LOC were Polyphenylene Sulfide (PPS) high modulus carbon fiber 55% and Liquid Crystal Polymer (LCP) carbon fiber. From the result it conclude that the PPS high modulus carbon fiber 55% is suitable for encapsulates LOC compared to LCP carbon fiber due to its strength, capable to endure deflection less than 100 um under uniform pressure applied on the top of encapsulation. 2009 Thesis NonPeerReviewed text en https://ir.uitm.edu.my/id/eprint/98476/1/98476.pdf Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim. (2009) Degree thesis, thesis, Universiti Teknologi MARA (UiTM).
institution Universiti Teknologi Mara
building Tun Abdul Razak Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Mara
content_source UiTM Institutional Repository
url_provider http://ir.uitm.edu.my/
language English
topic TK Electrical engineering. Electronics. Nuclear engineering
spellingShingle TK Electrical engineering. Electronics. Nuclear engineering
Abu Kassim, Mohd Nor Fadli
Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim
description This paper describes a deflection of encapsulation material on Lab-on-Chip (LOC) Biomedical device. The packaging technologies as described in this paper represent important steps in developing a user-friendly, practically usable encapsulation LOC device from a bare biochip. This development aims at a prototype device that can be applied for the evaluation of the biochip's analytical properties and the implementation of suitable assays in the field of medical diagnostic testing. The study involve in determine the best material for outer encapsulation which is required to protect the sensitive element on LOC during high-pressure transfer molded packaging process. The encapsulation material has to have maximum top surface deflection of 100 um under 100 atm vertical loading. The modeling was simulated using CoventorWare ver.2008 software. The material selected for these encapsulation LOC were Polyphenylene Sulfide (PPS) high modulus carbon fiber 55% and Liquid Crystal Polymer (LCP) carbon fiber. From the result it conclude that the PPS high modulus carbon fiber 55% is suitable for encapsulates LOC compared to LCP carbon fiber due to its strength, capable to endure deflection less than 100 um under uniform pressure applied on the top of encapsulation.
format Thesis
author Abu Kassim, Mohd Nor Fadli
author_facet Abu Kassim, Mohd Nor Fadli
author_sort Abu Kassim, Mohd Nor Fadli
title Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim
title_short Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim
title_full Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim
title_fullStr Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim
title_full_unstemmed Carbon fiber encapsulation for packaging biomedical Lab On Chip components / Mohd Nor Fadli Abu Kassim
title_sort carbon fiber encapsulation for packaging biomedical lab on chip components / mohd nor fadli abu kassim
publishDate 2009
url https://ir.uitm.edu.my/id/eprint/98476/1/98476.pdf
https://ir.uitm.edu.my/id/eprint/98476/
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score 13.209306