Intermetallic growth kinetics for Sn-3.5Ag-0.1Ni solder sandwiched between two copper substrates / Wan Nur Suhaiza Sukri
The intermetallic growth kinetics between Cu/Sn-3.5Ag-0.1Ni/Cu interfacial reactions were studied during reflow aging at 250℃ for 1, 10, 20, 30 and 40 minutes using Cu/Sn- 3.5Ag-0.1Ni/Cu sandwich solder. A typical Sn-Cu-Ni intermetallic compound layer was formed lower and upper interfacial after ref...
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| Format: | Student Project |
| Language: | English |
| Published: |
2021
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| Subjects: | |
| Online Access: | https://ir.uitm.edu.my/id/eprint/49657/1/49657.pdf https://ir.uitm.edu.my/id/eprint/49657/ |
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