APA引文

Sukri, W. N. S. (2021). Intermetallic growth kinetics for Sn-3.5Ag-0.1Ni solder sandwiched between two copper substrates / Wan Nur Suhaiza Sukri.

Chicago Style Citation

Sukri, Wan Nur Suhaiza. Intermetallic Growth Kinetics for Sn-3.5Ag-0.1Ni Solder Sandwiched between Two Copper Substrates / Wan Nur Suhaiza Sukri. 2021.

MLA引文

Sukri, Wan Nur Suhaiza. Intermetallic Growth Kinetics for Sn-3.5Ag-0.1Ni Solder Sandwiched between Two Copper Substrates / Wan Nur Suhaiza Sukri. 2021.

警告：這些引文格式不一定是100％准確.