Micro connector for high packaging density fabricated by using UV Thick Photoresist
A fork-type micro connector with high aspect ratio and high packaging density was fabricated using UV thick photoresist and Ni electroforming. A negative photoresist (THB-130N) was used as a mold of Ni electroforming. The tips of socket terminal of the micro connector were formed as movable portions...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Institute of Electrical Engineers of Japan
2002
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/33179/1/Micro_Connector_for_High_Packaging_Density_Fabricated_by_Using_UV_Thick_Photoresist.pdf http://irep.iium.edu.my/33179/ http://iss.ndl.go.jp/books/R000000004-I6152603-00 |
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