Micro connector for high packaging density fabricated by using UV Thick Photoresist

• Main Authors: Unno, Toshinori, Toriyama, Toshiyuki, Bhuiyan, Moinul, Yokoyama, Yoshihiko, Sugiyama, Susumu
• Format: Article
• Language: English
• Published: Institute of Electrical Engineers of Japan 2002
• Subjects: TA401 Materials of engineering and construction
• Online Access: http://irep.iium.edu.my/33179/1/Micro_Connector_for_High_Packaging_Density_Fabricated_by_Using_UV_Thick_Photoresist.pdf; http://irep.iium.edu.my/33179/; http://iss.ndl.go.jp/books/R000000004-I6152603-00

A fork-type micro connector with high aspect ratio and high packaging density was fabricated using UV thick photoresist and Ni electroforming. A negative photoresist (THB-130N) was used as a mold of Ni electroforming. The tips of socket terminal of the micro connector were formed as movable portions...