A Study on the Deposition of Tin on the Contac ts Subjected to High Frequency Impac t Loading in Semiconductor Device Testing
Semiconductor device leads were previously plated with Lead (Pb). Due to environmental concern, the plating material has been switched to Tin (Sn). However, due to the softness of Tin element plating, it often wears off and its residues deposited to the surface of the contacts used in semiconduct...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit UTeM
2011
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/9193/1/jmet.vol3.no1.fullpaper1.pdf http://eprints.utem.edu.my/id/eprint/9193/ http://jmet.utem.edu.my/index.php?option=com_docman&task=cat_view&gid=56&Itemid=40 |
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