The Effect of Trim and Form Process on the Plated Leads of IC Packages

• Main Author: Muhammad Saifuldin Bin Bakri, Muhammad Saifuldin
• Format: Final Year Project
• Language: English; English; English; English; English
• Published: Universiti Teknologi Petronas 2010
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://utpedia.utp.edu.my/1313/1/01_-_Front_page.pdf; http://utpedia.utp.edu.my/1313/2/02_-_Abstract%2C_ToC%2C_LoF%2C_Abb.pdf; http://utpedia.utp.edu.my/1313/3/03_-_Dissertation__Body_.pdf; http://utpedia.utp.edu.my/1313/4/04_-_Appendix_1.pdf; http://utpedia.utp.edu.my/1313/5/05_-_Appendix_2.pdf; http://utpedia.utp.edu.my/1313/

This dissertation presents the finding on the project “The Effect of Trim and Form Process on the Plated Leads of IC Packages”. This work was done in collaboration with IDS Electronics Sdn Bhd which is a semiconductor assembly house. One of the highest volume product in IDS is the SOT-23-3L EIAJ IC package. It is of great interest for IDS to study the effect of the trim and form process on the plated lead frame of this package type. The trim and form process is carried out after the electroplating process, thus there is a possibility of the tin plating being compromised by the trim and form steps. The methods of metallography are used extensively in this project from preparation of all the samples until observations and analyses by optical and scanning electron microscopy.