Evaluation of machine learning classifiers in faulty die prediction to maximize cost scrapping avoidance and assembly test capacity savings in semiconductor integrated circuit (IC) manufacturing

Semiconductor manufacturing is a complex and expensive process. The semiconductor packaging trending towards for more complex package with higher performance and lower power consumption. The silicon die is manufactured using smaller fab process technology node and packaging technology is using more...

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Bibliographic Details
Main Authors: Mohd Fazil, Azlan Faizal, Mohd Shaharanee, Izwan Nizal, Mohd Jamil, Jastini
Format: Article
Language:English
Published: AIP Publishing LLC 2019
Subjects:
Online Access:http://repo.uum.edu.my/27050/1/fazil2019.pdf
http://repo.uum.edu.my/27050/
http://doi.org/10.1063/1.5121089
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