An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study
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| Main Authors: | , , , |
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| Format: | Article |
| Published: |
Universitat Politecnica de Catalunya
2019
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85071756428&doi=10.3926%2fjiem.2742&partnerID=40&md5=960854de658600eaae54764ccfb18ea2 http://eprints.utp.edu.my/25242/ |
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