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An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study

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Main Authors: Hoe, H.K., Prakash, J., Kamaruddin, S., Seng, O.K.
Format: Article
Published: Universitat Politecnica de Catalunya 2019
Online Access:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85071756428&doi=10.3926%2fjiem.2742&partnerID=40&md5=960854de658600eaae54764ccfb18ea2
http://eprints.utp.edu.my/25242/
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spelling my.utp.eprints.252422021-08-27T09:05:36Z An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study Hoe, H.K. Prakash, J. Kamaruddin, S. Seng, O.K. Universitat Politecnica de Catalunya 2019 Article NonPeerReviewed https://www.scopus.com/inward/record.uri?eid=2-s2.0-85071756428&doi=10.3926%2fjiem.2742&partnerID=40&md5=960854de658600eaae54764ccfb18ea2 Hoe, H.K. and Prakash, J. and Kamaruddin, S. and Seng, O.K. (2019) An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study. Journal of Industrial Engineering and Management, 12 (2). pp. 340-355. http://eprints.utp.edu.my/25242/
institution Universiti Teknologi Petronas
building UTP Resource Centre
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Petronas
content_source UTP Institutional Repository
url_provider http://eprints.utp.edu.my/
format Article
author Hoe, H.K.
Prakash, J.
Kamaruddin, S.
Seng, O.K.
spellingShingle Hoe, H.K.
Prakash, J.
Kamaruddin, S.
Seng, O.K.
An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study
author_facet Hoe, H.K.
Prakash, J.
Kamaruddin, S.
Seng, O.K.
author_sort Hoe, H.K.
title An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study
title_short An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study
title_full An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study
title_fullStr An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study
title_full_unstemmed An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study
title_sort integrated model for adjustment of process parameters to recover throughput shortage in semiconductor assembly: a case study
publisher Universitat Politecnica de Catalunya
publishDate 2019
url https://www.scopus.com/inward/record.uri?eid=2-s2.0-85071756428&doi=10.3926%2fjiem.2742&partnerID=40&md5=960854de658600eaae54764ccfb18ea2
http://eprints.utp.edu.my/25242/
_version_ 1738656702437261312
score 13.214268

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