An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study
Saved in:
Main Authors: | , , , |
---|---|
Format: | Article |
Published: |
Universitat Politecnica de Catalunya
2019
|
Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85071756428&doi=10.3926%2fjiem.2742&partnerID=40&md5=960854de658600eaae54764ccfb18ea2 http://eprints.utp.edu.my/25242/ |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
id |
my.utp.eprints.25242 |
---|---|
record_format |
eprints |
spelling |
my.utp.eprints.252422021-08-27T09:05:36Z An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study Hoe, H.K. Prakash, J. Kamaruddin, S. Seng, O.K. Universitat Politecnica de Catalunya 2019 Article NonPeerReviewed https://www.scopus.com/inward/record.uri?eid=2-s2.0-85071756428&doi=10.3926%2fjiem.2742&partnerID=40&md5=960854de658600eaae54764ccfb18ea2 Hoe, H.K. and Prakash, J. and Kamaruddin, S. and Seng, O.K. (2019) An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study. Journal of Industrial Engineering and Management, 12 (2). pp. 340-355. http://eprints.utp.edu.my/25242/ |
institution |
Universiti Teknologi Petronas |
building |
UTP Resource Centre |
collection |
Institutional Repository |
continent |
Asia |
country |
Malaysia |
content_provider |
Universiti Teknologi Petronas |
content_source |
UTP Institutional Repository |
url_provider |
http://eprints.utp.edu.my/ |
format |
Article |
author |
Hoe, H.K. Prakash, J. Kamaruddin, S. Seng, O.K. |
spellingShingle |
Hoe, H.K. Prakash, J. Kamaruddin, S. Seng, O.K. An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study |
author_facet |
Hoe, H.K. Prakash, J. Kamaruddin, S. Seng, O.K. |
author_sort |
Hoe, H.K. |
title |
An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study |
title_short |
An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study |
title_full |
An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study |
title_fullStr |
An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study |
title_full_unstemmed |
An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study |
title_sort |
integrated model for adjustment of process parameters to recover throughput shortage in semiconductor assembly: a case study |
publisher |
Universitat Politecnica de Catalunya |
publishDate |
2019 |
url |
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85071756428&doi=10.3926%2fjiem.2742&partnerID=40&md5=960854de658600eaae54764ccfb18ea2 http://eprints.utp.edu.my/25242/ |
_version_ |
1738656702437261312 |
score |
13.18916 |