Electronics system thermal management optimization using finite element and nelder-mead method

The demand for high-performance, smaller-sized, and multi-functional electronics component poses a great challenge to the thermal management issues in a printed circuit board (PCB) design. Moreover, this thermal problem can affect the lifespan, performance, and the reliability of the electronic syst...

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Bibliographic Details
Main Authors: Ab. Majid, N. K., Ismail, F. S.
Format: Article
Language:English
Published: Universitas Ahmad Dahlan 2019
Subjects:
Online Access:http://eprints.utm.my/id/eprint/89744/1/NurulKausarMajid2019_ElectronicsSystemThermalManagement.pdf
http://eprints.utm.my/id/eprint/89744/
https://dx.doi.org/10.12928/TELKOMNIKA.v17i5.12796
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