Numerical simulation of a microchip cooling wth microjet array

• Main Authors: Yeo, Eng Soon, Mohd. Ghazali, Normah
• Format: Article
• Language: English
• Published: Faculty of Mechanical Engineering 2008
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/8735/3/YeoEngSoon2008_NumericalSimulationofaMicrochipCooling.pdf; http://eprints.utm.my/id/eprint/8735/

The increasing demand for a more powerful microchip has projected power dissipation for high performance processor up to 300 Watts in 2018. With the dimensions expected to remain at 310 mm2, the heat density approaches the limit of conventional cooling methods. Microjet impingement cooling is a pot...