Tapered spot size converter by mask-transfer self-written technology for optical interconnection
A compact spot size converter (SSC) is the key to the future of optical interconnection. Hence, we proposed a tapered SSC using mask-transfer self-written (MTSW) technology with UV-curable resin. MTSW technology guarantees an easy and fast fabrication concept that makes it a promising technology for...
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Institute of Electrical and Electronics Engineers Inc.
2017
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my.utm.762362018-06-26T07:53:27Z http://eprints.utm.my/id/eprint/76236/ Tapered spot size converter by mask-transfer self-written technology for optical interconnection Baharudin, N. A. Fujikawa, C. Mitomi, O. Suzuki, A. Taguchi, S. Mikami, O. Ambran, S. T Technology (General) A compact spot size converter (SSC) is the key to the future of optical interconnection. Hence, we proposed a tapered SSC using mask-transfer self-written (MTSW) technology with UV-curable resin. MTSW technology guarantees an easy and fast fabrication concept that makes it a promising technology for SSC devices. A prototype SSC adopting this technology was successfully fabricated. It was also confirmed that a tapered shape could be prepared from diffraction effect. A numerical calculation performed using the beam propagation method simulation shows that radiation loss decreases as SSC length increases. Comparison between the simulation and actual fabrication results shows acceptable value. Thus, this approach is reliable and has potential in the future of optical interconnection. Institute of Electrical and Electronics Engineers Inc. 2017 Article PeerReviewed Baharudin, N. A. and Fujikawa, C. and Mitomi, O. and Suzuki, A. and Taguchi, S. and Mikami, O. and Ambran, S. (2017) Tapered spot size converter by mask-transfer self-written technology for optical interconnection. IEEE Photonics Technology Letters, 29 (12). pp. 949-951. ISSN 1041-1135 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85021454486&doi=10.1109%2fLPT.2017.2694964&partnerID=40&md5=1993d303f010efea5ba2fb7e86839f69 |
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T Technology (General) Baharudin, N. A. Fujikawa, C. Mitomi, O. Suzuki, A. Taguchi, S. Mikami, O. Ambran, S. Tapered spot size converter by mask-transfer self-written technology for optical interconnection |
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A compact spot size converter (SSC) is the key to the future of optical interconnection. Hence, we proposed a tapered SSC using mask-transfer self-written (MTSW) technology with UV-curable resin. MTSW technology guarantees an easy and fast fabrication concept that makes it a promising technology for SSC devices. A prototype SSC adopting this technology was successfully fabricated. It was also confirmed that a tapered shape could be prepared from diffraction effect. A numerical calculation performed using the beam propagation method simulation shows that radiation loss decreases as SSC length increases. Comparison between the simulation and actual fabrication results shows acceptable value. Thus, this approach is reliable and has potential in the future of optical interconnection. |
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Article |
author |
Baharudin, N. A. Fujikawa, C. Mitomi, O. Suzuki, A. Taguchi, S. Mikami, O. Ambran, S. |
author_facet |
Baharudin, N. A. Fujikawa, C. Mitomi, O. Suzuki, A. Taguchi, S. Mikami, O. Ambran, S. |
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Baharudin, N. A. |
title |
Tapered spot size converter by mask-transfer self-written technology for optical interconnection |
title_short |
Tapered spot size converter by mask-transfer self-written technology for optical interconnection |
title_full |
Tapered spot size converter by mask-transfer self-written technology for optical interconnection |
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Tapered spot size converter by mask-transfer self-written technology for optical interconnection |
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Tapered spot size converter by mask-transfer self-written technology for optical interconnection |
title_sort |
tapered spot size converter by mask-transfer self-written technology for optical interconnection |
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Institute of Electrical and Electronics Engineers Inc. |
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2017 |
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http://eprints.utm.my/id/eprint/76236/ https://www.scopus.com/inward/record.uri?eid=2-s2.0-85021454486&doi=10.1109%2fLPT.2017.2694964&partnerID=40&md5=1993d303f010efea5ba2fb7e86839f69 |
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