Tapered spot size converter by mask-transfer self-written technology for optical interconnection
A compact spot size converter (SSC) is the key to the future of optical interconnection. Hence, we proposed a tapered SSC using mask-transfer self-written (MTSW) technology with UV-curable resin. MTSW technology guarantees an easy and fast fabrication concept that makes it a promising technology for...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Published: |
Institute of Electrical and Electronics Engineers Inc.
2017
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/76236/ https://www.scopus.com/inward/record.uri?eid=2-s2.0-85021454486&doi=10.1109%2fLPT.2017.2694964&partnerID=40&md5=1993d303f010efea5ba2fb7e86839f69 |
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| Summary: | A compact spot size converter (SSC) is the key to the future of optical interconnection. Hence, we proposed a tapered SSC using mask-transfer self-written (MTSW) technology with UV-curable resin. MTSW technology guarantees an easy and fast fabrication concept that makes it a promising technology for SSC devices. A prototype SSC adopting this technology was successfully fabricated. It was also confirmed that a tapered shape could be prepared from diffraction effect. A numerical calculation performed using the beam propagation method simulation shows that radiation loss decreases as SSC length increases. Comparison between the simulation and actual fabrication results shows acceptable value. Thus, this approach is reliable and has potential in the future of optical interconnection. |
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