Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers

• Main Authors: Kuwano, N., Horikami, S., Linas, M.
• Format: Article
• Published: Trans Tech Publications Ltd. 2015
• Subjects: T Technology (General)
• Online Access: http://eprints.utm.my/id/eprint/59248/; http://www.dx.doi.org/10.4028/www.scientific.net/MSF.827.341

The changes of microstructure in pure-Sn after deformation were investigated by electron microscopy. Two types of specimens were prepared: Sample-1; pure-Sn/Fe-42Ni, Sample-2; single crystalline pure-Sn. The growth of curling whiskers on Sample-1 was observed in-situ in a scanning electron microscope (SEM). A thin foil specimen of the curling whisker was made with a focused ion beam (FIB) mill. Transmission electron microscope (TEM) analysis confirmed that the curling whisker was of a single crystal regardless of its external shape. New models for growth process of a bent single-crystalline whisker were proposed. The models are composed of epitaxial growth and recrystallization. Electron back scatter diffraction (EBSD) analysis was performed for Sample-2. The results of EBSD strongly suggested that recrystallization proceeds even at room temperature. These experimental results are very important to understand the behavior of dynamical deformation and recrystallization of Sn metal, and useful in consideration the mitigation of whiskers.