Numerical modeling of cyclic stress-strain behavior Of sn-pb solder joint during thermal fatigue

This study examines the cyclic stress-strain response of solder joints in a surface mounted electronic assembly due to temperature cycles. For this purpose, a threedimensional model of an electronic test package is analyzed using finite element method. The model consists of 92 solder joints arran...

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Bibliographic Details
Main Authors: Tamin, M N, Liew, Y B
Format: Article
Language:English
Published: Universiti Kebangsaan Malaysia 2005
Subjects:
Online Access:http://eprints.utm.my/id/eprint/470/1/cem05-039_MNTamin__Ed_3.pdf
http://eprints.utm.my/id/eprint/470/
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