Etching performance improvement on semiconductor silicon wafers with redesigned etching drum

Etching process involves various chemical reactions and reflects significantly on the silicon wafer quality. The paper addresses the major problem on wafers during etching that is wafer removal distribution throughout etching drum compartment. The etchant used in this study were the composition of H...

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Bibliographic Details
Main Authors: Dolah, Rozzeta, Musa, Hamidon, Amrin, Astuty
Format: Article
Published: Penerbit UTM Press 2011
Subjects:
Online Access:http://eprints.utm.my/id/eprint/44908/
http://dx.doi.org/10.11113/jt.v55.77
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