Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
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Universiti Teknologi Malaysia
2009
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my.utm.38072014-01-02T04:18:02Z http://eprints.utm.my/id/eprint/3807/ Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products Jaswadi, Farizana TJ Mechanical engineering and machinery Universiti Teknologi Malaysia 2009 Thesis NonPeerReviewed Jaswadi, Farizana (2009) Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products. Masters thesis, Universiti Teknologi Malaysia, Faculty of Mechanical Engineering. |
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TJ Mechanical engineering and machinery |
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TJ Mechanical engineering and machinery Jaswadi, Farizana Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products |
format |
Thesis |
author |
Jaswadi, Farizana |
author_facet |
Jaswadi, Farizana |
author_sort |
Jaswadi, Farizana |
title |
Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
|
title_short |
Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
|
title_full |
Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
|
title_fullStr |
Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
|
title_full_unstemmed |
Experimental and finite element investigation of dynamic behavior of chassis-PCB assembly of electronic products
|
title_sort |
experimental and finite element investigation of dynamic behavior of chassis-pcb assembly of electronic products |
publisher |
Universiti Teknologi Malaysia |
publishDate |
2009 |
url |
http://eprints.utm.my/id/eprint/3807/ |
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1643643896252596224 |
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13.209306 |