Effect of etching as pre-treatment for electroless copper plating on silicon wafer

• Main Authors: Mior Shahidina, Shazatul Akmaliah, Fadila, Nor Akmal, Yusopa, Mohd Zamri, Tamina, Mohd Nasir, Osman, Saliza Azlina
• Format: Article
• Published: Penerbit UTM Press 2017
• Subjects: T Technology (General); TP155-156 Chemical engineering
• Online Access: http://eprints.uthm.edu.my/5600/

Metallic coatings, such as copper films can be easily deposited on semiconductor materials like silicon wafer without prior surface pre-treatment using the electroless process. However, the adhesion of the copper film can be very weak and can easily peels off. In this study, the effect of etching in...