APA引文

M.A., R. A. (2019). The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn-4.0 Ag-0.5Cu/ENImAg. Wiley-VCH Verlag.

Chicago Style Citation

M.A., Rabiatul Adawiyah. The Effect of Cooling Rate During Multiple Reflow Soldering On Intermetallic Layer of Sn-4.0 Ag-0.5Cu/ENImAg. Wiley-VCH Verlag, 2019.

MLA引文

M.A., Rabiatul Adawiyah. The Effect of Cooling Rate During Multiple Reflow Soldering On Intermetallic Layer of Sn-4.0 Ag-0.5Cu/ENImAg. Wiley-VCH Verlag, 2019.

警告：這些引文格式不一定是100％准確.