Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process

Chipping free is a dream for wafer sawing process. With current high complexity of wafer technology plus the drive for cost reduction by narrowing the saw street width, it is a challenge which requires huge effort for wafer sawing process to achieve chipping free process. Higher density of metalliza...

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Bibliographic Details
Main Authors: Mohd Noh, Mohd Syahrin Amri, Liew, David, Harun, Fuaida
Format: Article
Language:English
English
Published: IEEE Conference Publications 2010
Subjects:
Online Access:http://eprints.utem.edu.my/id/eprint/5199/1/Syahrin_IEMT_2010.pdf
http://eprints.utem.edu.my/id/eprint/5199/2/chipping_free_process.pdf
http://eprints.utem.edu.my/id/eprint/5199/
https://ieeexplore.ieee.org/document/5746667
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