Copper wire bond improvement on aluminum interface for optimum high emperature storage reliability performance

• المؤلف الرئيسي: Wong, Jia Yi
• التنسيق: أطروحة
• اللغة: English; English
• منشور في: 2021
• الموضوعات: T Technology (General); TS Manufactures
• الوصول للمادة أونلاين: http://eprints.utem.edu.my/id/eprint/26955/1/Copper%20wire%20bond%20improvement%20on%20aluminum%20interface%20for%20optimum%20high%20emperature%20storage%20reliability%20performance.pdf; http://eprints.utem.edu.my/id/eprint/26955/2/Copper%20wire%20bond%20improvement%20on%20aluminum%20interface%20for%20optimum%20high%20emperature%20storage%20reliability%20performance.pdf; http://eprints.utem.edu.my/id/eprint/26955/; https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121720

Copper wire bonding has becoming popular as semiconductor packaging interconnect method due to its advantages over gold wire. Lower cost, better conductivity and lower resistivity are the main factors. Copper wires are harder than gold wire, therefore higher ultrasonic power and bond force require f...