DSC assessment on curing degree of micron-scaled adhesive layer in lamination-pressed flexible printed circuit panels
Continuous monitoring and optimisation of the lamination process are critical in negating flexible printed circuit (FPC) delamination risk during operation. The main QC inspection criterion of the lamination adhesive’s curing degree is adhesive thickness. However, this method is prone to measuremen...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
UiTM Press
2021
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| Online Access: | http://eprints.utem.edu.my/id/eprint/26267/2/8-RI-18-3-P21-04.PDF http://eprints.utem.edu.my/id/eprint/26267/ https://jmeche.uitm.edu.my/wp-content/uploads/2021/09/8-RI-18-3-P21-04.pdf |
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