DSC assessment on curing degree of micron-scaled adhesive layer in lamination-pressed flexible printed circuit panels / Kok-Tee Lau, Hoi Ern Kok and Nur Hazirah Rosli

• Main Authors: Lau, Kok-Tee, Hoi, Ern Kok, Rosli, Nur Hazirah
• Format: Article
• Language: English
• Published: Universiti Teknologi MARA 2021
• Subjects: Mechanical and electrical engineering combined; Steam engineering
• Online Access: https://ir.uitm.edu.my/id/eprint/52968/1/52968.pdf; https://ir.uitm.edu.my/id/eprint/52968/

Continuous monitoring and optimisation of the lamination process are critical in negating flexible printed circuit (FPC) delamination risk during operation. The main QC inspection criterion of the lamination adhesive’s curing degree is adhesive thickness. However, this method is prone to measurement...