Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process

• Main Author: Liou, Jacqueline Jing Wen
• Format: Thesis
• Language: English; English
• Published: 2020
• Subjects: T Technology (General); TJ Mechanical engineering and machinery
• Online Access: http://eprints.utem.edu.my/id/eprint/25573/1/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf; http://eprints.utem.edu.my/id/eprint/25573/2/Experimental%20Investigation%20Of%20Mechanical%20Dicing%20Parameters%20On%20The%20Quality%20Of%20Thin%20Glass%20Wafer%20Cutting%20Process.pdf; http://eprints.utem.edu.my/id/eprint/25573/; https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119122

Silicon-glass device has been adopted in the industry especially used on applications like pressure sensor, accelerometer, microfluidic device, micropump, microturbine, and micro-actuator. In this study, the focus of the package application is current sensors with component of an ultra-thin silicon...