Effect Of Contact Pad’s Roughness And Ni–P Plating Thickness On Leadless Packages’ Shear Strength Variation

• Main Authors: Lau, Kok Tee, Munawar, Rose Farahiyan, Arif@Harip, Afraha Baiti, Ong, C. G.
• Format: Article
• Language: English
• Published: The Korean Institute of Electrical and Electronic Material Engineers 2020
• Online Access: http://eprints.utem.edu.my/id/eprint/24642/2/LAU2020.PDF; http://eprints.utem.edu.my/id/eprint/24642/; https://link.springer.com/article/10.1007/s42341-020-00218-8

Studies on shear strength of thin small leadless packages (TSLP) focused predominantly on solder and refow factors. Contact pad’s surface roughness (Ra) and Ni–P thickness factors, though rather important, have not been reported widely. Thus, the current study investigates the efect of TSLP’s contac...